Munich, Germany – 28 September 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the XENSIV™ TLx49012, a ...
Read moreDetailsHoofddorp, Netherlands, 15th September 2026: Murata Manufacturing Co., Ltd and Smart Eye are collaborating to demonstrate how camera-radar sensor fusion can create a ...
Read moreDetailsProduct designers may assume a high shock rating means a MEMS accelerometer is rugged enough for harsh environments, but shock ...
Read moreDetailsTessenderlo-Ham, Belgium, 3 September 2026 – Melexis will bring an extensive range of advanced sensing, protection, and driver technologies to ...
Read moreDetailsTessenderlo-Ham, Belgium, 1 September 2026 – Melexis introduces the MLX90381 5V, expanding its compact Triaxis® pico-resolver to support a wider range of ...
Read moreDetailsSingapore – August 31, 2026 — GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, today announced a new strategic franchise partnership ...
Read moreDetails- The new edgeRX Pro sensor node expands the capabilities of TDK SensEI's flagship edgeRX platform. - Enhanced performance delivers ...
Read moreDetailsSmaller, multi-camera platform enables scalable Ethernet architectures for NVIDIA Edge AI systems while lowering power, cost and integration complexity National, ...
Read moreDetailsLOS ANGELES – EMASS, a Nanoveu subsidiary specializing in ultra-efficient edge AI semiconductor technology, today announced a collaboration with Bosch ...
Read moreDetailsExecutive Insight From a late-80s bet that microelectronics would become the automotive industry's heartbeat to today's push into robotics and ...
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