Semiconductor News Nexperia brings QDPAK packaging to 1200 V SiC MOSFETs to overcome thermal bottlenecks in high-power designs June 9, 2026
Semiconductor News Navitas Introduces Isolated Through-Hole Package for SiC MOSFETs, Enabling Direct-Cooled Thermal Management June 9, 2026
Semiconductor News Cadence Announces Collaboration with Intel Foundry to Accelerate Intel 14A Process Optimization for HPC and Mobile Designs June 9, 2026
Semiconductor News TI brings intelligence to battery management systems with industry’s highest-cell-count EIS-enabled battery monitor June 9, 2026
Semiconductor News DigiKey Launches Vietnam Website, Expanding Commitment to Asian Electronics Industry June 9, 2026