New evaluation board for a 400G EAM, based on OpenLight’s heterogeneous integration of InP-on-Si process, is available for testing, and...
Read moreDetailsAcceleRate Slim Cable Assemblies support high-density computing, FPGA prototyping and emulation, and MIPI protocols with new signaling options. New...
Read moreDetailsNoida, 17 March 2026, Cadence, a global leader in computational software, today announced the appointment of Dr. Alok Jain as the managing director for the India...
Read moreDetailsWith India's electronics output growing six-fold in a decade, Henkel opens a co-innovation hub designed for what comes next. Bengaluru,...
Read moreDetailsNew 60 V, 900 mA normally open SSR delivers 5,000 VRMS reinforced isolation and reliable operation up to +105 °C...
Read moreDetailsFuse EDA AI Agent autonomously orchestrates multi-agent workflows across Siemens' complete electronic design automation (EDA) portfolio, from design conception through...
Read moreDetailsMar 16, 2026 Infineon to accelerate next-generation humanoid robots enabled by digital twins in collaboration with NVIDIA Scalable deployment of...
Read moreDetailsThe breakthrough, 800 V–6 VDC-DC power delivery board eliminates traditional 48V intermediate bus converter stage while improving system efficiency, reliability,...
Read moreDetailsAs wireless connectivity becomes central to automotive, industrial IoT, and smart infrastructure, Vaishali Umredkar, Editor of Semiconductor For You speaks...
Read moreDetailsTA101 TrustFLEX and TA101 TrustMANAGER combine factory- or in-field provisioned secure authentication ICs with scalable FOTA and cryptographic key management...
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