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High-Efficiency Multi-Phase SPI Boost Controller from Diodes Incorporated Enables Robust, Flexible Automotive Headlight Systems
Plano, Texas – March 12, 2026 – Diodes Incorporated (Diodes) (Nasdaq: DIOD) strengthens its power management portfolio with the introduction of...
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Posifa Technologies Introduces PVC4001-C MEMS Pirani Vacuum Transducer for Wide-Range Vacuum Measurement
Compact Device Combines Pirani Sensing and an Onboard Barometric Pressure Sensor for Portable Gauges and Leak Detection Systems SAN JOSE,...
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Melexis Strengthens Commitment to China with New Wholly Foreign-Owned Enterprise (WFOE) and Autonomous Regional Organization
Tessenderlo-Ham, Belgium – 12 March 2026 – Melexis (Euronext Brussels: MELE), a global leader in micro-electronic semiconductor solutions, today announced the formal establishment...
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VIAVI Launches TestCenter D2 1.6T Appliance to Accelerate AI Infrastructure Rollouts
Bangalore - March 13, 2026 – VIAVI Solutions has announced the launch of its next-generation TestCenter D2 1.6T Appliance designed to help cloud...
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Qualitas Semiconductor Selects Anritsu’s Vector Network Analyzer for High-Speed Interconnect Signal Integrity Verification
ANRITSU CORPORATION is pleased to announce that Qualitas Semiconductor Co., Ltd. (hereinafter “Qualitas”), a leading developer specializing in PHY IP...
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Ayar Labs and Wiwynn Partner to Bring Co-Packaged Optics to Rack-Scale AI Systems
Collaboration moves CPO beyond component-level innovation and into deployable AI infrastructure for hyperscale workloads SAN JOSE, Calif., and TAIPEI, Taiwan...
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Advanced Energy Launches LPP200 Series of Low-Profile AC-DC Supplies for Miniaturization of Medical and Industrial Devices
Safety certified power supplies with leading power density and 0.75-inch profile DENVER, Colo., March 11, 2026 — Advanced Energy Industries, Inc....
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STMicroelectronics enters high-volume production of its industry-leading silicon photonics platform to support AI infrastructure demand
PIC100 technology in 300 mm high-volume production for leading hyperscalers, with plans to quadruple capacity by 2027 and further expand...
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Navitas Adds Top-Side Cooled QDPAK and Low-Profile TO-247-4L to its Package Line-Up in the Latest 5th Generation GeneSiC™ Technology
QDPAK and Low-profile TO247 in the latest GeneSiC™ 5th Generation Trench-Assisted Planar SiC MOSFET technology deliver significant improvements in performance and...
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OpenLight to Showcase Breakthrough III-V Heterogenous Integrated Silicon Photonics Innovations and Production Capabilities for AI, Cloud, and High‑Speed Networking at OFC 2026
SANTA CLARA, Calif. OpenLight, a leader in heterogeneous III‑V silicon photonic integration and custom Photonic Application‑Specific Integrated Circuits (PASICs), will...
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