Bosch introduces third generation SiC chips for EV growth and local ecosystem enablement
▶ The new generation of SiC chips deliver 20 percent higher performance ▶ More than 60 million SiC chips already delivered worldwide ...
Read moreDetails▶ The new generation of SiC chips deliver 20 percent higher performance ▶ More than 60 million SiC chips already delivered worldwide ...
Read moreDetailsTop-side cooled SMD package provides a practical route to higher power density and system efficiency while simplifying heatsink and mechanical ...
Read moreDetailsDirect-cooled thermal management offered by a reflow-compatible, isolated thermal pad significantly improves power density, reliability, and efficiency. Integrated aluminum nitride ...
Read moreDetailsInfineon and Siemens collaborate to drive semiconductor circuit breaker technology for data centers, production facilities and battery storage systems Semiconductor ...
Read moreDetailsSee the QSiC™Gen3 line, now offering high-thermal-performance options featuring AlN substrates and pre-applied TIM, on display at Booth #110 in ...
Read moreDetailsTORRANCE, CA – Jun 3rd, 2026 — Navitas Semiconductor (Nasdaq: NVTS), an industry leader in next-generation GaNFast™ gallium nitride (GaN) and GeneSiC™ silicon carbide (SiC) power ...
Read moreDetailsMunich, Germany – 29 May 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has achieved a new milestone ...
Read moreDetailsHighlights include two SST solutions for converting the MV grid to 800V HV DC, a 10 kW, 800 V-to-50 V ...
Read moreDetailsQSiC™Gen3 line featuring 1200V SOT-227, S3 half-bridge, B2T1 six-pack and B3 full-bridge packages on display at Booth #1451 February 18, ...
Read moreDetailsThe latest GeneSiC™ 5th Generation Trench-Assisted Planar (TAP) SiC MOSFET technology delivers significant improvements in performance, reliability, and robustness for AI ...
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